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April 3, 2020


113. Large-area grain-boundary-free copper films for plasmonics

S. H. Chew, A. Gliserin, S. Choi, X. T. Geng, S. Kim, W. Hwang, K. Baek, N. D. Anh, Y.-J. Kim, Y. M. Song, D. E. Kim, S.-Y. Jeong, S. Kim

Appl. Sur. Sci. 521 (2020).



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