​ ​

April 3, 2020

 

113. Large-area grain-boundary-free copper films for plasmonics

S. H. Chew, A. Gliserin, S. Choi, X. T. Geng, S. Kim, W. Hwang, K. Baek, N. D. Anh, Y.-J. Kim, Y. M. Song, D. E. Kim, S.-Y. Jeong, S. Kim

Appl. Sur. Sci. 521 (2020).

[PDF]

 

Share on Facebook
Share on Twitter
Please reload

School of Electrical Engineering and Computer Science, Gwangju Institute of Science Technology,

123, Cheomdangwagi-ro, Buk-gu, Gwangju 61005, Korea

Tel : +82-62-715-2655 Fax : +82-62-715-2657

© 2017 by FOEL. Proudly created by YJs. All Rights reserved.